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PLEASE NOTE:
It has come to our attention that an issue with our website is preventing it from sending the automated emails related to orders. Due to this, you may not receive your order confirmation, shipping details, and the final invoice. If you do not hear from us regarding your order 2-3 days after your order was placed, please email sales@saikosystems.com. We apologize for any inconvenience this may cause.
Design and Manufacturing Services
Can't find exactly what you need for your application? Have a specific or custom project in mind? Have a new product in mind? No problem!
Saiko Systems provides complete Original Design Manufacturing (ODM) services to suit your needs. We can help you design, manufacture, and test your product or component!
Our services include: R&D, electrical schematic capture, PCB design & manufacturing, electrical assembly and box build services, Housing/Enclosure design & manufacturing, and product testing. We specialize in turn-key design and manufacturing, which means we do all the hard work (finding the best components for your application, interfacing with manufacturers and suppliers, finding the lowest price on components across multiple vendors, purchasing and managing inventory, and manufacturing). Click on the categories below for further details.
To request a quote, or for more information, please email
sales@saikosystems.com
Click the categories below for more information.
Leverage Saiko System's many years of experience in designing Embedded Systems and let us help you create your next product.
Whether you have an idea sketched on a napkin, or simply need a PCB designed for your project, we are here to help and make the process as simple and painless as possible.
Our experience includes, but not limited to:
- Design for Manufacturing
- Design for Usability
- Consumer Devices
- Digital Design
- Analog Design
-
Industrial control and automation
- Microcontrollers / Microprocessors
- M2M Communication
- ZigBee (IEEE 802.15)
- Embedded WiFi (IEEE 802.11)
- Embedded Ethernet (IEEE 802.3)
- Accelerometers and sensors
- USB devices
- Flash controller devices
- Global Positioning Systems (GPS)
- Embedded Graphics
- Embedded User Interfaces
- Resistive and capacitive touch screens
- LCD controllers
- E-Paper
- NFC
- Wireless Power / Energy Harvesting
- Audio Devices
- Robotics
All ODM solutions are designed in the USA and our manufacturing processes comply with the latest IPC and RoHs standards.
Our broad experience in creating single and multilayer boards
will ensure you receive an efficient, high quality design which will reduce fabrication cycles required and ultimately reduce the time to market for you product. Please contact us regarding your specific project needs to learn how we can help.
Whether your requirements are simple, such as single-sided circuit boards, or more complex, such as multi-layered printed circuit boards with fine lines, flex circuits, or rigid-flex circuits, we can meet your PCB manufacturing needs with an IPC Class II or higher standard.
With facilities located both here at home in the USA, and
overseas in China, Saiko Systems is well equipped to meet all our clients' PCB needs from quick turn prototypes to high quantity production at very competitive prices.
To request a quote, or for more information, please email
sales@saikosystems.com
with your Gerber files and any specifications and special requirements. We look forward to serving your PCB needs.
Click below to view our capabilities:
| USA Capabilities |
China Capabilities |
|
     
USA Capabilities:
| Maximum Number of Layers: |
32 |
| Maximum Board Thickness: |
0.300"+ |
| Minimum Board Thickness: |
0.016" for Multi-Layer. |
| Maximum Board Length: |
22" for Multi-Layer
45' for 2-layer |
| Minimum Trace Spacing: |
4 mils (0.004") for Production Runs
3 mils (0.003") for Prototypes |
| Minimum Trace Width: |
4 mils (0.004") for Production Runs
3 mils (0.003") for Prototypes
|
| Minimum Hole Size: |
0.004" |
| Maximum Outer Copper Thickness: |
15 oz. |
| Maximum Inner Copper Thickness: |
5 oz. |
| Maximum Warpage Allowed: |
0.010 inch / inch |
| Maximum Registration Deviation: |
0.0015" |
| Maximum Hole Size Deviation: |
0.0005" |
| Maximum Deviation: |
± 10% |
| Blind & Buried Vias: |
Yes |
| Plugged Vias: |
Yes |
| Materials: |
CEM-1, CEM-3, Polyimides (various), BT-Epoxy, FR-4, FR-406, FR-408, GETEK, Rogers, Teflon (various), Brass Substrate, Aluminum Substrate, |
| Tg & Td: |
high Tg, Td or per customer request |
| Etching: |
Ammonia Etch, Petra Etch |
| Plating & Finishes: |
HASL, HASL-LF, Tin-Lead, RoHS Lead-free Tin, Tin-Nickel, Electroless Nickel Immersion Gold (ENIG), Selective Gold Plating, Nickel Plating, Hard Gold, Flash Gold, Wire Bondable Gold, Immersion Silver, Gold Finger |
| Solder Mask: |
SMOBC, PISM, OSP Finish, LPISM |
| Advanced: |
Controlled Impedance, Embedded Resistance |
China Capabilities:
| Maximum Number of Layers: |
12 |
| Maximum Board Thickness: |
7.0mm |
| Minimum Board Thickness: |
0.2mm |
| Maximum Board dimensions: |
750mm x 850mm
|
| Minimum Trace Spacing: |
4 mils (0.1016mm) |
| Minimum Trace Width: |
4 mils (0.1016mm) |
| Minimum Hole Size: |
0.2mm |
| Hole Tolerance: |
PTH: ± 0.075mm
NPTH: ± 0.05mm |
| Maximum Outer Copper Thickness: |
6oz (1oz = 3um) |
| Maximum Inner Copper Thickness: |
4oz (oz = 3um) |
| Maximum Deviation: |
± 10% |
| Blind & Buried Vias: |
Yes |
| Plugged Vias: |
Yes |
| Materials: |
FR-4, PTFE, Getek, Nelco |
| Tg & Td: |
high Tg, Td or per customer request |
| Plating & Finishes: |
Electroless Nickel Immersion Gold (ENIG), Immersion Silver, Gold Finger |
| Solder Mask: |
SMOBC, OSP, LPISM, HASL-LF |
| Advanced: |
Controlled Impedance |
|
Saiko Systems also offers value added services through partners for additional customer requirements.
These services include:
- Casing/Enclosure Design & Manufacturing
- Industrial Design & Manufacturing
- Regulatory and Compliance Testing
Please contact us with your specific needs to learn how we can help!