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TSSOP Exposed Pad Prototyping Board

RoHs Compliant

TSSOP Pad Pitch:  

Hole Diameter:  
0.047" (1.2mm)
plated holes

T/H Pad: 
0.08" (2.032mm)  
round pads

Hole Spacing:  
0.1" (2.54mm)


Electroless Nickel
Immersion Gold (ENIG)
PCB Thickness:  
0.062" (1.57mm)

Mounting Holes:  
4-40 size, plated

The TSSOP prototyping boards are designed to allow quick and easy circuit prototyping of TSSOP chips with a center pad. The boards also offer 0.08” round pads with 0.047“ plated holes spaced 0.1” apart which can be used to solder DIP headers or wires to interface with the chip. The spacing of the holes also allows the boards to be connected to a standard 0.1” pitch bread-board with ease.

TSSOP Exposed Pad Prototyping Board


PDF File PT-TSSOP-EP Data Sheet

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All prices indicated on this website are retail catalog prices. If you would like to make a wholesale or large quantity purchase, please request a quote by adding the desired item(s) to the shopping cart and selecting "I want to Request a Quote" during checkout.

Note: Items marked with (*) are wholesale only. A quote is required and minimums may apply.

Ordering Information:

Board Size

Additional sizes indicated in the datasheet are currently available for wholesale only. Please email us for a quote.

1.45" x 0.82" - 28 Pins
Packaging Options

Retail Packaging With UPC and EAN-13 barcodes, ready to be placed on retail selves are also available. If you require a wholesale purchase with retail packaging please email us for a quote.

OEM Packaging
Base Price: $0.00 Configured Price: $6.95
As configured Part Number:
  • 1.45" x 0.82" - 28 Pins
  • OEM Packaging